Overview
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047
Key Details
| Property | Value |
|---|---|
| CVE ID | CVE-2024-43047 |
| Vendor / Product | Qualcomm — Multiple Chipsets |
| NVD Published | 2024-10-07 |
| NVD Last Modified | 2025-10-28 |
| CVSS 3.1 Score | 7.8 |
| CVSS 3.1 Vector | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
| Severity | HIGH |
| CWE | CWE-416 |
| CISA KEV Added | 2024-10-08 |
| CISA KEV Deadline | 2024-10-29 |
| Known Ransomware Use | No |
CVSS 3.1 Breakdown
Attack Vector
Local
Attack Complexity
Low
Privileges Required
Low
User Interaction
None
Scope
Unchanged
Confidentiality
High
Integrity
High
Availability
High
Required Action
CISA BOD 22-01 Deadline: 2024-10-29.
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Timeline
| Date | Event |
|---|---|
| 2024-10-08 | Added to CISA Known Exploited Vulnerabilities catalog |
| 2024-10-29 | CISA BOD 22-01 remediation deadline |
References
| Resource | Type |
|---|---|
| NVD — CVE-2024-43047 | Vulnerability Database |
| CISA KEV Catalog Entry | US Government |